Followup to Toshiba 3100e

From: Russ Blakeman <rhblake_at_bbtel.com>
Date: Fri Sep 4 16:52:54 1998

Next best thing to thermal transfer compound. Evidentally the 286 chip is one of the
older non-C types that generate a lot of heat

Charles E. Fox wrote:

> Problem has apparently been solved by re-seating the 286 chip and putting
> silicon grease between the chip and the heatsink. It has been going now for
> several hours.
> Thanks anyway, folks.
>
> Cheers
>
> Charlie Fox

--
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Received on Fri Sep 04 1998 - 16:52:54 BST