HP & Compaq

From: Absurdly Obtuse <vance_at_ikickass.org>
Date: Tue Sep 4 13:44:04 2001

On Tue, 4 Sep 2001, Carlos Murillo wrote:

> HP needed better production technology than what they had in
> order for their new chip design to stick. The choices were DEC,
> Intel and IBM. Guess what happened.

IBM is doing the multi-layer ceramic interconnect packaging for the
Itanium.

Peace... Sridhar
Received on Tue Sep 04 2001 - 13:44:04 BST