On Fri, 19 Nov 2004 00:25:01 +0000 (GMT),Tony Duel wrote:
>However, I would always claim a schematic can be produced (direct
>chip-on-board being a possible exception!).
The other 'newer' exception would be ball-grid-array packaged parts.
Fortunately, the most interesting things to reverse-engineer are still
mostly through-hole with conventional DIP packaging, etc.
Received on Thu Nov 18 2004 - 23:02:17 GMT
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