>
> On Fri, 19 Nov 2004 00:25:01 +0000 (GMT),Tony Duel wrote:
>
> >However, I would always claim a schematic can be produced (direct
> >chip-on-board being a possible exception!).
>
> The other 'newer' exception would be ball-grid-array packaged parts.
True, but this is classiccmp :-)
>
> Fortunately, the most interesting things to reverse-engineer are still
> mostly through-hole with conventional DIP packaging, etc.
Conventioanl SMDs (SOICs, SOT transistors, etc) are a pain due to the
close spacing of the connections (you need good probes), but still
possible.
-tony
Received on Fri Nov 19 2004 - 18:10:54 GMT
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