E.U.N.U.C.H. (Materialthickness)

From: Hans Franke <Hans.Franke_at_mch20.sbs.de>
Date: Fri Nov 19 10:33:29 1999

> >> >> P.S.: When designing a new cooler element/radiator, keep in mind that
> >> >> silver is a way better thermal conductor than Al or Cu.

> >It's a simple design, operating just on water, and always around
> >room temperature - and I pushed an K6-2 300 up to 500 MHz...
> >(Of course copper would also be ok ... I just compared the price,
> >and for less than 50 bucks difference I got a cool silver thingy :)

> With a cooler that is chip/plate/water don't you want to keep the "plate"
> as thin as possible?

Jep, since phi = lambda*S*delta-T / delta . Just, I didn't use a
simple plate and only one waterlayer, but rather a system of pipes
(drilled holes) to have a) a better controll for the water flow and
b) enlarge the plate / water contact by three. As larger the
surface (S) as higher the possible thermal current (vulgo amount
of transported heat). I can't enlarge the chips surface, so S is
fixed between chip and 'plate', but I can enlarge S between 'plate'
and water.

The minimal thickness is defined by your tools and skills - I used
0.8 mm (~1/30 inch) as minimal thickness betreen one pipe and the


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Received on Fri Nov 19 1999 - 10:33:29 GMT

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