E.U.N.U.C.H. (Materialthickness)

From: Hans Franke <Hans.Franke_at_mch20.sbs.de>
Date: Fri Nov 19 15:08:53 1999

> >> With a cooler that is chip/plate/water don't you want to keep the "plate"
> >> as thin as possible?

> >Jep, since phi = lambda*S*delta-T / delta . Just, I didn't use a
> >simple plate and only one waterlayer, but rather a system of pipes
> >(drilled holes) to have a) a better controll for the water flow and
> >b) enlarge the plate / water contact by three. As larger the
> >surface (S) as higher the possible thermal current (vulgo amount
> >of transported heat). I can't enlarge the chips surface, so S is
> >fixed between chip and 'plate', but I can enlarge S between 'plate'
> >and water.

> >The minimal thickness is defined by your tools and skills - I used
> >0.8 mm (~1/30 inch) as minimal thickness betreen one pipe and the
> >chip.

> Since we are talking fluid cooling, anybody putting a heatsink on both
> sides of the chip?

> I would not worry too much about the water side, pressure and flow can work
> wonders there, but would keep the copper plate just thick enough to avoid
> hot spots and cover as much of the chip surface as electrically possible.

Well, sounds gut at first sight - just three problems:
First you have only a _very_ small free area on the 'other' side - there
are some nasty pins, and somehor it is no-good to touch them.
Ans second, this is hard to do in any standard board - and even
with custom extenders you still have to connect them and the
wire length becomes a problem - adding 10% corespeed and loosing
20% bus speed isn't exactly a gain.


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Ich denke, also bin ich, also gut
Received on Fri Nov 19 1999 - 15:08:53 GMT

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