E.U.N.U.C.H. (Materialthickness)

From: Mike Ford <mikeford_at_socal.rr.com>
Date: Mon Nov 22 12:23:48 1999

>I just see I forgot to mention problem number 3:
>The bottom side has (AFAIK) never a usable (and thermal
>relevant) connection to the chip itself. wouldn't it be
>somewhat stupid to rely on thermal transport into a region
>where under all normal circumstanses no or only a minimal
>heatremovel is possible ?).

That would be the fundamental problem, and I thought it was just the
opposite, but I suspect you may be right. The bottom does look a lot like a
"cap" now that I think about it.
Received on Mon Nov 22 1999 - 12:23:48 GMT

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