E.U.N.U.C.H. (Materialthickness)

From: Hans Franke <Hans.Franke_at_mch20.sbs.de>
Date: Mon Nov 22 06:52:16 1999

> >> Since we are talking fluid cooling, anybody putting a heatsink on both
> >> sides of the chip?
> >> I would not worry too much about the water side, pressure and flow can work
> >> wonders there, but would keep the copper plate just thick enough to avoid
> >> hot spots and cover as much of the chip surface as electrically possible.

> >Well, sounds gut at first sight - just three problems:
> >First you have only a _very_ small free area on the 'other' side - there
> >are some nasty pins, and somehor it is no-good to touch them.
> >Ans second, this is hard to do in any standard board - and even
> >with custom extenders you still have to connect them and the
> >wire length becomes a problem - adding 10% corespeed and loosing
> >20% bus speed isn't exactly a gain.

> What I had in mind was a hole in the motherboard, perhaps two (water
> in/out), with a small plate making contact directly under the "chip". My
> guess is that it could be substantly more effective given the internal
> construction of most chips.

Well, take a look at any ordinary board, and you will notice that
the 'free' space below the CPU isn't free at all - 4 to 6 layers
of connections - and I just asume they may have some sense - also
the reachaple surface is _very small (less than 3cm^2).

I just see I forgot to mention problem number 3:
The bottom side has (AFAIK) never a usable (and thermal
relevant) connection to the chip itself. wouldn't it be
somewhat stupid to rely on thermal transport into a region
where under all normal circumstanses no or only a minimal
heatremovel is possible ?).


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Ich denke, also bin ich, also gut
Received on Mon Nov 22 1999 - 06:52:16 GMT

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